| Features | Requirement | Remark |
|---|---|---|
| Wafer handling |
- 8, 12 inch - Cassette recognition sensor for 8, 12inch wafer |
8 inch wafer frame size 276mm |
| Process | Thermo-Compression flip chip bonding including epoxy dispensing | User will define required bonding head |
| Alignment accuracy |
+/‑2 microns at 3sigma +/-0.02’ at 3sigma |
Bonding accuracy (n = 125) per head |
| Placement accuracy |
+/‑2 microns at range +/-0.02’ at range |
Bonding accuracy (n = 10) per head |
| Die thickness |
3x3 ～ 6x6 : min 40um 6x6～10x10 :min 50um 10x10～15x15 :min100um 15x15～ :min 150um |
