Introduction

CO₂ Laser를 이용하여 PCB 기판에 홀을 가공하는 장비

Features

• The high-peak power and short pulse time laser is utilized for stable and high quality process in your applications.
• High accuracy and precision drilling can be achievable by the fast distortion correction technique and digital controlled galvanos.
• Both of process route optimization and high speed galvanos realize the improvement of productivity in industry.
• Laser gas can be refilled with fast and easy manner. After refilling the gas only in a few minutes, it can be used for years.

Machine Key Specification

CO2 Laser drilling system		Specifications	Remarks
Processing	Processing method	dual heads processing	process two panels simultaneously
	Maximum applicable board size(*)	610 x 510mm
	Processing hole size(*)	Ø80~320µm	Depends on applicable materials (Polyimide, Epoxy, Glass-epoxy, Copper sheet)
Laser	Wavelength	9.4µm	CO2 laser
	Average output power	≥180W
	Pulse modulation frequency range	Single shot to 4.5kHz
	Pulse width range	2~26µs
	Gas refill time	In a few minutes
Processing head	Scanning frequency	3,000Hz x 2heads	Digital control
	Maximum scan area(*)	60 x 60mm
	Processing lens	fθ lens
	Spot roundness	≥95%
XY table	Maximum feed speed	1,200mm/sec
	Position repeatability	≤±1µm
Total accuracy	Positioning and drilling	≤±12µm
Outline	Dimension (W x H x D) (*)	2,200 x 2,000 x 2,400mm
	(including auto loader & unloader unit)	(4,100 x 2,000 x 2,400mm)
	Weight	Approx. 7,000kg

* 상기 Specification은 고객 요청에 따라 변경됨.