Rigid/Flexible OLED 패널을 Stick&Cell 단위로 정밀 Cutting하기 위해 Pico UV Laser를 이용하여 선을 긋고 이후 물리적 Breaking을 하는 장비입니다.
| Cutting size | 1.4” ~ 15” |
|---|---|
| Tact time | 4sec/cell (5.5”) |
| Half cutting | Ps Laser |
| Full cutting | Mechanical breaking |
| Cutting accuracy | ± 50um |
| Substrate size | Max. 925mm X 1,500mm |
* 상기 Specification은 고객 요청에 따라 변경됨.
Laser cutting system for Flexible AMOLED
| Cutting size | 1” ~ 13.3” |
|---|---|
| Tact time | 2.5sec/cell (5.5”) |
| Pad cutting | CO2 Laser |
| Cell cutting | CO2 + fs Laser |
| Corner cutting | ps Laser |
| Cutting accuracy | ± 50um |
| Model change | Working table & Cell transfer exchange (auto change ≤ 10 min.) |
| Substrate size | Max. 925mm X 1,500mm |
* 상기 Specification은 고객 요청에 따라 변경됨.
