Introduction

  • This equipment inspects wiring integrity and determines defect after connecting substrate wiring during the NANO LED manufacturing process.
  • A substrate set up for inspection is inspected for the wiring of the substrate using an optical meter, and the resistance of the wiring is measured.
  • After completion of inspection and measurement, save defective images (odd value measurement), extract data, and provide the user with the desired information.


Main Components

  • Load / Unload Transfer
  • Align Unit : Vision Align
  • Inspection Optic System : Acquires Raw image using optical instrument
  • Probe Unit
  • Wiring impedance measurement unit



Machine Key Specification

Dimension L 1,600 x W 2,000 x H 1,800(mm)

* The above specification changes according to the Inspection Cell size.